Delivering comprehensive electronic interconnect technology, empowering customers to turn ideas into products.
Our Technology
Deca is the leading independent provider of advanced packaging technology to the semiconductor industry. Our M-Series™ technology is the industry’s highest volume fan-out, powering the world’s smartphones.
Our Adaptive Patterning® offers a novel approach to overcome natural variation in manufacturing, with over 6 billion devices shipped.
What We Do
Technology Enablement
Realize advanced packaging capabilities with proven processes, materials, equipment, and know-how
Consulting
Accelerate your implementation with experienced professionals across multiple disciplines
Design Services
Collaborate with expert designers to create next generation interconnect solutions
News
ASU and Deca Technologies selected to lead $100M SHIELD USA project to strengthen U.S. semiconductor packaging capabilities
TEMPE, Ariz., November 21, 2024 –The National Institute of Standards and Technology — part of…
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Arizona State University and Deca Technologies to Pioneer North America’s First R&D Center for Advanced Fan-Out Wafer-Level Packaging
Advanced packaging advances next wave of innovation in global chips manufacturing TEMPE, Ariz. – March…
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SkyWater Florida and Deca Technologies Announce $120M DOD Award to Expand Advanced Packaging Capabilities in Osceola County, Florida
SkyWater is the first domestic provider of Deca’s M-Series™ fan-out and Adaptive Patterning® technologies to support the…
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