Press Releases

Deca Announces Agreement with IBM to Bring High-Density Fan-Out Interposer Production to North America

ASU and Deca Technologies selected to lead $100M SHIELD USA project to strengthen U.S. semiconductor packaging capabilities

Arizona State University and Deca Technologies to Pioneer North America’s First R&D Center for Advanced Fan-Out Wafer-Level Packaging

SkyWater Florida and Deca Technologies Announce $120M DOD Award to Expand Advanced Packaging Capabilities in Osceola County, Florida

Deca Technologies’ Founder and CEO Tim Olson Receives Founder’s Award at 55th IMAPS Symposium

SkyWater Signs Technology Transfer and License Agreement for Deca’s Gen 2 M-Series Fan-out and Adaptive Patterning Technology

Deca collaborates with ASE and Siemens to launch APDK™ design methodology

YES Adds Deca’s Rapid Cure Technology to its Product Line

Deca Partners with ADTEC Engineering to Enhance Adaptive Patterning™ for 2µm Chiplet Scaling

nepes corporation to acquire Deca Technologies manufacturing operations

Advanced Fan-out Technology Breakthrough: Deca Technologies’ M-Series™ Identified in Samsung S10, Xiaomi Mi 9 and LG G8 Handsets

Mentor adds DECA Technologies to growing Mentor OSAT Alliance for high density advanced package (HDAP) designs

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