Press Releases

Deca collaborates with ASE and Siemens to launch APDK™ design methodology

YES Adds Deca’s Rapid Cure Technology to its Product Line

Deca Partners with ADTEC Engineering to Enhance Adaptive Patterning™ for 2µm Chiplet Scaling

nepes corporation to acquire Deca Technologies manufacturing operations

Advanced Fan-out Technology Breakthrough: Deca Technologies’ M-Series™ Identified in Samsung S10, Xiaomi Mi 9 and LG G8 Handsets

Mentor adds DECA Technologies to growing Mentor OSAT Alliance for high density advanced package (HDAP) designs

Deca Technologies Receives Major Investment for M-Series™ Fan-out Growth

Cypress Subsidiary Deca Technologies to Receive $60 Million Investment from ASE

Deca Technologies Exceeds Half Billion Units Shipped

Deca Technologies Ships 100-Millionth Wafer-Level Packaged Component

Deca Technologies Introduces Chris Seams as New CEO

Deca Technologies Unveils M-Series™ CSP with Adaptive Patterning™