Deca offers design services for IC package design.
Our design engineers are trained experts and experienced in the latest EDA tools and packaging technologies.
EDA Tool Expertise
- Cadence Advanced Package Designer
- Siemens Xpedition Package Designer
- Siemens Calibre Physical Verification
Our design team supports a variety of IC package technologies including:
- Fan-out wafer level packaging (FOWLP)
- Fan-out panel level packaging (FOPLP)
- 2.5 & 3D Chiplets
- Flip Chip BGA and CSP
- Package on package (PoP)
- Embedded bridge die interposer
- Passive & active interposer
