Design Services

Deca offers design services for IC package design.

Our design engineers are trained experts and experienced in the latest EDA tools and packaging technologies.

EDA Tool Expertise

Our design team supports a variety of IC package technologies including:

  • Fan-out wafer level packaging (FOWLP)
  • Fan-out panel level packaging  (FOPLP)
  • 2.5 & 3D Chiplets
  • Flip Chip BGA and CSP
  • Package on package (PoP)
  • Embedded bridge die interposer
  • Passive & active interposer

Contact us to learn more or request a quote

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