News and Media

Books

M-Series™ Fan-Out with Adaptive Patterning™

Technology Papers

Using Deca’s Adaptive Patterning™ to win the Chiplet Integration race

Technology Papers

New Adaptive Patterning Techniques for the Chiplet Era

Books

Adaptive Patterning and M-Series for High Density Integration

Technology Papers

Adaptive Patterning Design Methodologies

Technology Papers

Scaling M-Series™ for Chiplets

Technology Papers

Deca & ASE Scaling M-Series & Adaptive Patterning to 600mm

Technology Papers

Deca & Cadence Breakthrough Heterogeneous Integration Barriers with Adaptive Patterning™

Press Releases

SkyWater Signs Technology Transfer and License Agreement for Deca’s Gen 2 M-Series Fan-out and Adaptive Patterning Technology

Press Releases

Deca collaborates with ASE and Siemens to launch APDK™ design methodology

Deca in the News

EE Times: Deca Technologies, Part 2 – Adaptive Patterning

Deca in the News

EE Times: Deca Technologies, Part 1 – Spinning Square Platters