Press ReleasesDeca Announces Agreement with IBM to Bring High-Density Fan-Out Interposer Production to North America
Press ReleasesASU and Deca Technologies selected to lead $100M SHIELD USA project to strengthen U.S. semiconductor packaging capabilities
Deca in the NewsASU News: Advanced packaging the next big thing in semiconductors — and no, we’re not talking about boxes
Press ReleasesSkyWater Florida and Deca Technologies Announce $120M DOD Award to Expand Advanced Packaging Capabilities in Osceola County, Florida
Deca in the NewsYahoo! Finance: Deca Technologies’ Founder and CEO Tim Olson Receives Founder’s Award at 55th IMAPS Symposium
Press ReleasesDeca Technologies’ Founder and CEO Tim Olson Receives Founder’s Award at 55th IMAPS Symposium
Press ReleasesSkyWater Signs Technology Transfer and License Agreement for Deca’s Gen 2 M-Series Fan-out and Adaptive Patterning Technology
