Press ReleasesAdvanced Fan-out Technology Breakthrough: Deca Technologies’ M-Series™ Identified in Samsung S10, Xiaomi Mi 9 and LG G8 Handsets
Press ReleasesMentor adds DECA Technologies to growing Mentor OSAT Alliance for high density advanced package (HDAP) designs
Deca in the News3D InCites: Tim Olson Talks About Deca’s Approach to Fan-Out System on Chip (FO SoC) at 3D ASIP
Deca in the NewsI-micronews.com: Fan-out Packaging – The Most Dynamic Advanced Packaging Platform. Will It Be Sustainable Long-term?
