March 1, 2018

The 2018 3DInCites Awards recognize industrywide achievements in the development of heterogeneous integration technologies with categories from Research Institute of the Year to Materials Supplier of the Year. This year, Deca Technologies’ M-Series, a fan-out wafer-level (WLFO) packaging technology, won Device of the Year for its high reliability and innovative process.

M-Series was nominated for addressing some of the key limitations the market faces, courtesy of the adaptive processing combined with planar front-side molding. The investment of over $110M in Deca by two of the giants of the industry is a testimony to this technology. In particular, M-Series is the only WLFO solution with Adaptive Patterning™, which accommodates die shift, thereby resolving yield issues that may occur due to the placement tolerance.

Deca Technologies proudly accepted this award during the iMAPS Device Packaging Conference on March 7, 2018, in Fountain Hills, Arizona.

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Deca Technologies’ Tim Olson & Chris Scanlan with 3D InCites’ Françoise von Trapp.