Conference and Publication Listing
2024
| Nepcon Japan 2024 | Jan ’24 | Patterning Technology that Realizes a Chiplet Structure and the Latest Laser Direct Imaging Lithography (LDI) Technology Capable of 2um L/S | Cliff S. et. al. |
| Chiplet Summit 2024 | Jan ’24 | Choosing from the Bewildering Menu of Advanced Packaging Options | Craig B., et. al. |
2023
| EPTC 2023 | Dec ’23 | Deca & ASE M-Series Bridge Die Compensation & Adaptive Patterning in a Multi-Die Module in 600 mm Format | Cliff S. et. al. |
| IMAPS Az Chapter Seminar | Nov ’23 | Achieving High-Density Die-to-Die Integration with Adaptive Pad Stacks on a Molded Embedded Bridge Die Interposer | Cliff S. et. al. |
| IMAPS Symposium 2023 | Oct’23 | Gen 2 M-Series Fan-Out for Chiplet Integration, UCIe, and HBM3 | Craig B., et. al. |
| IMAPS FL Workshop | Sept ’23 | Ultra-High-Density Integration of Chiplets using Adaptive Patterning for High Performance Computing | Cliff S. et. al. |
| ECTC 2023 | May ’23 | Integrating Chiplets using Chips First Ultra-High-Density Fan-out with Maskless Laser Direct Imaging and Adaptive Patterning for High Performance Computing | Benedict S.J., et al. |
| Synopsys SNUG Silicon Valley 2023 | Mar’23 | Next-gen Fan-out Technology & EDA for Multi-Die Integration | Craig B., et. al. |
| IMAPS DPC 2023 | Mar’23 | Scaling Interconnect Densities Meeting the Growing Demand for Chiplet Integration | Robin D., et. al. |
| IMAPS DPC 2023 | Mar’23 | Squaring Off with M-Series Fan-Out Technology | Cliff S. et. al. |
| SMTA Wafer Level Packaging Symposium ’23 | Feb’23 | Large Heterogenous Integration Devices Drive Large Panel Fan-out | Benedict S.J., et al. |
| Chiplet Summit 2023 | Jan’23 | Next-gen Fan-out Interconnect for Chiplets and Beyond | Craig B., et. al. |
2022
| EPTC 2022 | Dec ’22 | Mask-less Laser Direct Imaging & Adaptive Patterning Solution for Fan-Out Heterogeneous Integration on 600mm | Cliff S. et. al. |
| EPTC 2022 | Dec ’22 | Reducing the Thermal Budget in Low-Temperature Polyimide Dielectric Cure for Laser Direct Image Patterning in Advanced Backend Applications | Cliff S. et. al. |
| SMTA Intl Electronics Manufacturing Conference ’22 | Nov’22 | Heterogenous Integration using Fan-out Wafer-level Packaging (FOWLP) Technology to Produce High Performance and Low-Cost Multi-Chip Modules | Tim O., et. al. |
| IMAPS Symposium 2022 | Oct ’22 | Bridging the Interconnect Gap for High Performance Computing using an M-Series Embedded Cache Interposer | Benedict S.J., et al. |
| ECTC 2022 | May ’22 | Evolution of Interconnect EDA for Chiplets and Heterogeneous Integration | Craig B. |
| ECTC 2022 | May ’22 | Harnessing the power of 4nm silicon with Gen 2 M-Series™ Fan-out and Adaptive Patterning® enabling ultra-high-density 20µm device bond pad pitch | Robin D., et. al. |
| IMAPS DPC 2022 | Mar’22 | Mask-less Laser Direct Imaging & Adaptive Patterning Solution for Fan-Out Heterogeneous Integration | Cliff S. et. al. |
| IMAPS DPC 2022 | Mar’22 | Scaling Up while Scaling Down with M-Series™ Fan-out & Adaptive Patterning® | Tim O., et. al. |
| IMAPS DPC 2022 | Mar’22 | High-density Fan-Out Chip on Substrate using M-Series™ and Adaptive Patterning® Technology | Robin D., et. al. |
| SMTA Wafer Level Packaging Symposium ’22 | Feb’22 | Chips First or Chips Last? – Answering the Key Questions for the Adoption of Heterogenous Integration | Benedict S.J., et al. |
2021
| Raytheon 3DHI Workshop | Nov’21 | Ultra-high-density Embedded Die Interposers for 3D Heterogenous Integration created with M-Series Fan-out and Adaptive Patterning Technology | Benedict S.J., et al. |
| IMAPS DPC 2021 | Apr’21 | Setting the 600mm Large Panel Fan-Out Standard with M-Series™ | Cliff S. et. al. |
| IMAPS DPC 2021 | Apr’21 | New Adaptive Patterning Techniques for the Chiplet Era | Craig B., et. al. |
| IMAPS DPC 2021 | Apr’21 | Using Deca’s Adaptive Patterning to Win the Chiplet Integration Race with Siemens EDA and ASE | Robin D., et. al. |
| ECTC 2021 | June’21 | Deca & Cadence Breakthrough Heterogeneous Integration Barriers with Adaptive Patterning™ | Ed H., et. al. |
| ECTC 2021 | June’21 | Scaling M-Series™ for Chiplets | Cliff S. et. al. |
Published Articles
| Chip Scale Review – Nov 2022 | Nov’22 | Large-panel fan-out perspective on cost, yield, and capability | Cliff S. et. al. |
| Semiconductor Review – Dec 2020 | Dec’20 | Deca: Rewriting the rules of chip interconnection | Richmond S. |
