News and Media

Deca in the News

2021 3D InCites Awards Nominees

YES Adds Deca’s Rapid Cure Technology to its Product Line

Deca Partners with ADTEC Engineering to Enhance Adaptive Patterning™ for 2µm Chiplet Scaling

Deca in the News

Semiconductor Engineering: Planning For Panel-Level Fan-Out

Deca in the News

3D InCites: The IWLPC Fan-out PLP Smack Down

Deca in the News

Semiconductor Engineering: M-Series Multi Site Capability

nepes corporation to acquire Deca Technologies manufacturing operations

Deca in the News

3D InCites: Deca FOWLP is Going Mainstream

Advanced Fan-out Technology Breakthrough: Deca Technologies’ M-Series™ Identified in Samsung S10, Xiaomi Mi 9 and LG G8 Handsets

Deca in the News

I-micronews.com: New commercialization of Deca Technologies’ Fan-Out technology

Deca in the News

Semiconductor Engineering: Lithography Challenges For Fan-Out

Mentor adds DECA Technologies to growing Mentor OSAT Alliance for high density advanced package (HDAP) designs

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