Arizona State University is poised to be a major player in this next breakthrough in microchip technology. The university is one of the few in the country that is teaching advanced packaging to its students, creating the skilled workforce that’s desperately needed by the semiconductor industry. A key asset in doing that is ASU’s partnerships with industry leaders to research the next innovations as well as create a cutting-edge production line.
ASU has launched a ground-breaking collaboration with Deca Technologies, a Tempe, Arizona-based provider of advanced packaging technology. ASU and Deca will create North America’s first fan-out wafer-level packaging research and development center. The new Center for Advanced Wafer-Level Packaging Applications and Development will expand domestic semiconductor manufacturing and drive advancements in artificial intelligence, machine learning, automotive electronics and high-performance computing.
