November 9, 2011
TEMPE, AZ–(Marketwire – Nov 9, 2011) – Charting a new course for the future of electronic systems, Deca Technologies has launched a breakthrough approach to creating advanced electronic interconnect solutions. Leveraging the unique, cost-effective solar wafer manufacturing methods of SunPower Corp. (NASDAQ: SPWRA) (NASDAQ: SPWRB) and financial, operational and manufacturing support from Cypress Semiconductor Corp. (NASDAQ: CY), Deca’s proprietary solutions uniquely position it to reshape the way the world designs and manufactures electronic devices.
Deca’s initial products include a series of WLCSP (Wafer Level Chip Scale Packaging) derivatives targeted at the current $1 billion-plus WLP (Wafer Level Packaging) market. Growth in WLPs continues to be driven primarily by the desire of handset OEMs to integrate more features and functionality into less space. Miniaturization, cost and performance benefits increasingly lead to a preference for WLP solutions. However, as traditional strip-based package technologies give way to advanced wafer-based methods, significant capital strain and cycle time challenges have burdened the supply chain.