November 11, 2011
WOODSIDE, Calif.—Deca Technologies Inc., a startup backed by Cypress Semiconductor Inc. and SunPower Inc., came out of stealth mode Wednesday (Nov. 9) to describe its initial focus on providing wafer-level chip scaling packaging (WLCSP) services to semiconductor companies through a process that company representatives say is dramatically faster and substantially less costly than what is currently available on the market.
T.J. Rodgers, president and CEO of Cypress and chairman of Deca, said the company’s manufacturing advantages stem largely from its relationship with SunPower, the former Cypress-back solar wafer manufacturer. Deca established its initial process line within SunPower’s manufacturing facility in the Philippines, where it benefited from the manufacturing know how of SunPower, which builds PV modules using a continuous flow manufacturing process that Rodgers said costs a fraction of what it costs to produce a conventional semiconductor wafer.
“The company would be very much less well off if they weren’t little brother to SunPower,” Rodgers said.