Deca has partnered with industry-proven EDA partners to develop a fully integrated Adaptive Patterning® design workflow.
Cadence is a pivotal leader in electronic systems design, building upon more than 30 years of computational software expertise. The company applies its underlying Intelligent System Design strategy to deliver software, hardware, and IP that turn design concepts into reality. Cadence, an industry leader in advanced IC packaging tools, collaborates with Deca Technologies on innovative designs including a novel multi-chip(let), high-density RDL packaging solution built on top of Deca Adaptive Patterning® and Cadence Allegro packaging technologies. This approach helps our customers remove several design hurdles while providing a low-cost alternative to existing packaging technologies.
Siemens partnership with Deca is focused on the development and validation of an Adaptive Patterning workflow. This workflow encompasses co-design planning, physical implementation through to substrate and package assembly verification. Siemens tuned its Xpedition Package Designer and Calibre DRC & LVS technologies to support Deca’s Adaptive Patterning requirements.
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