Chairman of the Board
Dana Nazarian was named chairman of Deca Technologies in August 2016. He was named executive vice president of Operations & Technology of Cypress Semiconductor in the same month. Nazarian was executive vice president for the Memory & Imaging division from 2009 to 2016.
Nazarian is a career Cypress employee. He joined the company in 1988 as a product engineer, and was later promoted to fab process engineering manager, responsible for half of Cypress’ Fab 2 facility in Round Rock, Texas. In 1994, Nazarian became yield manager for Fab 2—a position he held for three years.
Steve Hanson is a senior partner in Southwest Value Acquisitions, a private equity firm. He has more than 32 years of experience as a senior executive of technology companies, including 28 years at Motorola in various engineering, management and leadership positions, such as three years as corporate vice president and general manager of the Europe, Middle East and Africa Semiconductor Group, and culminating as senior vice president and general manager for the Standard Components Group. For more than three years, Mr. Hanson was president and chief executive officer of ON Semiconductor, where he led a very rapid transformation from a private entity to a public company amid a major acquisition and a process of transforming the company into a global leader in power management technologies.
Thad Trent joined the board of Deca Technologies in December 2017. He is executive vice president and chief financial officer at Cypress, responsible for overseeing Cypress’ global finance operations, including strategic planning, accounting, investor relations, tax, corporate development and information technology. Since being promoted to the position in 2014, Trent has directed Cypress’ M&A strategy, including the acquisition of Broadcom’s Internet of Things business, the merger with Spansion, and several divestitures to position the company as a leader in advanced embedded solutions for the fast-growing markets of automotive, industrial and consumer. He has more than 25 years of experience in the technology industry, with a proven track record of building scalable operational infrastructure and leading strategic corporate development and capital market transactions to accelerate revenue and profitability.
Tim Olson founded Deca Technologies in 2009 with a mission to transform the way the world creates advanced electronic products. Currently CEO, he has also served as CTO, while continuously serving as a board member. Throughout his career, Tim led multiple breakthrough innovations. As Senior VP of Amkor Technology, he led global research and development, introducing Package-on-Package Through Mold Via (PoP TMV) technology, FusionQuad, and the industry’s first high-volume fine pitch Cu pillar flip-chip. As Executive VP of Products and Operations at Micro Component Technology, Tim led development of specialized equipment and software establishing the industry’s first high-volume strip-based test. While at Motorola Semiconductor, Tim led creation of the PRISM highly automated and integrated assembly and test factory bringing 2D codes from NASA to semiconductors for tracking and traceability.
Rich Rice – ASE Global
The ASE Group is the world’s largest provider of independent semiconductor manufacturing services in assembly, test, materials and design manufacturing. As a global leader geared towards meeting the industry’s ever growing needs for faster, smaller and higher performance chips, the Group develops and offers a wide portfolio of technology and solutions including IC test program design, front-end engineering test, wafer probe, wafer bump, substrate design and supply, wafer level package, flip chip, system-in-package, final test and electronic manufacturing services through Universal Scientific Industrial Co., Ltd. and its subsidiaries, members of the ASE Group. The Group generated sales revenues of US$8.64 billion in 2015 and employs over 65,000 people worldwide.
President / Global Marketing Unit
Tae-Hoon (TH) Kim is president of nepes Corporation where he leads the company in localizing key technologies that are essential to semiconductor device manufacturing. Mr. TH Kim joined the Deca Technologies Board of Directors in February 2020 in conjunction with nepes’ equity investment in the company.
TH first joined nepes in 2016 as head of the global business development unit. nepes’ semiconductor portfolio includes wafer bumping, wafer level packaging and fan-out wafer level packaging. The company is known for identifying customer needs and meeting them in the rapidly growing mobile and IoT markets.
Prior to nepes, TH spent the majority of his career in various roles at Samsung Electronics. He joined the company as an LSI chip design R&D engineer for development of PC chipset and participated in various projects related to the development of Samsung Semiconductor. For example, he worked with global IT majors such as Google, Apple and Microsoft, and led the marketing and product planning teams in the system LSI business unit of Samsung Semiconductor, steering $10B worth of business with major mobile players.
TH holds a bachelor’s degree in electronic engineering from Korea University.