Chairman of the Board
Sam Geha, Ph.D., was named CEO of Infineon Technologies LLC, Memory Solutions in April 2020. He was the Corporate Executive Vice President of the Memory Product Division in September 2016. Previously, he served as the Senior Vice President of the Intellectual Property (IP) Business Unitsince June 2015, where he oversaw licensing of the Company’s various embedded nonvolatile memory technologies (SONOS and eCT) to foundries, including TSMC, UMC, HLMC and HH-Grace, as well as licensing the Company’s 3D NAND technology to XMC. Under Mr. Geha, the IP Business unit significantly expanded its revenue, market share and technology leadership. Prior to that, he was the Vice President of the Technology R&D organization since May 2007. Mr. Geha created the original business plan for Deca Technologies, Inc., a Wafer-Level Chip-Scale Packaging start-up, funded by the Company and SunPower. He also serves as a board member of Enovix, a Silicon-based Lithium Ion battery start-up co-funded by the Company. Mr. Geha joined the Company in 1995 and has served as the senior director of technology development for SONOS and the director of technology development for MRAM and SRAM technologies. He has worked in the technology industry since 1991 and has a deep understanding of how chips are developed, designed and qualified.Prior to joining the Company, he worked in various technology development functions at Motorola and National Semiconductor.Mr. Geha holds a bachelor of science degree in electrical engineering (BSEE), a master of science in electrical engineering (MSEE) and a philosophical doctorate in electrical engineering (Ph.D.) from the University of Arizona.
Steve Hanson is a senior partner in Southwest Value Acquisitions, a private equity firm. He has more than 32 years of experience as a senior executive of technology companies, including 28 years at Motorola in various engineering, management and leadership positions, such as three years as corporate vice president and general manager of the Europe, Middle East and Africa Semiconductor Group, and culminating as senior vice president and general manager for the Standard Components Group. For more than three years, Mr. Hanson was president and chief executive officer of ON Semiconductor, where he led a very rapid transformation from a private entity to a public company amid a major acquisition and a process of transforming the company into a global leader in power management technologies.
Larry is currently Vice-President, General Counsel & Secretary for the Americas Region of Infineon Technologies, overseeing all aspects of in-house legal, corporate secretarial services and counsel, and has served in this capacity following the acquisition of International Rectifier Corporation by Infineon Technologies in 2015.
Prior to that, Larry served in various capacities in the legal department functions of International Rectifier since joining that company in 1999, and before that in the legal department of Allegheny Teledyne Inc. since 1996. Larry began his legal career in 1985 with the law firm of Mitchell, Silberberg, and Knupp, and subsequent to that practiced law with the firm of Seyfarth, Shaw, Fairweather and Geraldson from 1987 to 1996. Larry graduated from the University of Illinois with a B.S. in Chemical Engineering. He also earned a J.D. from the University of Michigan Law School and is admitted to the California State Bar.
Tim Olson founded Deca Technologies in 2009 with a mission to transform the way the world creates advanced electronic products. Currently CEO, he has also served as CTO, while continuously serving as a board member. Throughout his career, Tim led multiple breakthrough innovations. As Senior VP of Amkor Technology, he led global research and development, introducing Package-on-Package Through Mold Via (PoP TMV) technology, FusionQuad, and the industry’s first high-volume fine pitch Cu pillar flip-chip. As Executive VP of Products and Operations at Micro Component Technology, Tim led development of specialized equipment and software establishing the industry’s first high-volume strip-based test. While at Motorola Semiconductor, Tim led creation of the PRISM highly automated and integrated assembly and test factory bringing 2D codes from NASA to semiconductors for tracking and traceability.
ASE Global – Rich Rice
The ASE Group is the world’s largest provider of independent semiconductor manufacturing services in assembly, test, materials and design manufacturing. As a global leader geared towards meeting the industry’s ever growing needs for faster, smaller and higher performance chips, the Group develops and offers a wide portfolio of technology and solutions including IC test program design, front-end engineering test, wafer probe, wafer bump, substrate design and supply, wafer level package, flip chip, system-in-package, final test and electronic manufacturing services through Universal Scientific Industrial Co., Ltd. and its subsidiaries, members of the ASE Group. The Group generated sales revenues of US$8.64 billion in 2015 and employs over 65,000 people worldwide.
Shankar Raj Ekambaram
Shankar Raj Ekambaram is Sr. Director, Sourcing at Qualcomm and oversees its global outsourced semiconductor package & test manufacturing services, including WW capacity planning. At Qualcomm he enabled the development and adoption of MEP PoP, M-series Fan-out, SiP and other interconnect technologies into Snapdragon Mobile platforms and products. Prior to Qualcomm, he was at Conexant, Mindspeed Technologies and Tower Jazz Foundry in in various technology transfer, outsourced manufacturing engineering and operational roles.
Tae-Hoon (TH) Kim is president of nepes Corporation where he leads the company in localizing key technologies that are essential to semiconductor device manufacturing. Mr. TH Kim joined the Deca Technologies Board of Directors in February 2020 in conjunction with nepes’ equity investment in the company. TH first joined nepes in 2016 as head of the global business development unit. nepes’ semiconductor portfolio includes wafer bumping, wafer level packaging and fan-out wafer level packaging. The company is known for identifying customer needs and meeting them in the rapidly growing mobile and IoT markets. Prior to nepes, TH spent the majority of his career in various roles at Samsung Electronics. He joined the company as an LSI chip design R&D engineer for development of PC chipset and participated in various projects related to the development of Samsung Semiconductor. For example, he worked with global IT majors such as Google, Apple and Microsoft, and led the marketing and product planning teams in the system LSI business unit of Samsung Semiconductor, steering $10B worth of business with major mobile players. TH holds a bachelor’s degree in electronic engineering from Korea University.