Published in: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
Authors: Clifford Sandstrom, Timothy Olson, Steve Fang, Jeffrey Yang
Abstract: Currently running at volumes in the millions per day on 300mm round format, Deca’s M-Series fan-out technology and Adaptive Patterning are being scaled up to 600mm for production. The SEMI standard 600 mm square format originally pioneered by Deca, provides a 500% increase in usable area per panel providing cost-effective capacity growth as well as a powerful platform for high density integration of multi-die and chiplets in 2D, 2.5D and 3D structures. The yield challenges of preparing for pilot 600 mm production will be examined including examples of how Deca’s Adaptive Patterning™ coupled with special die attach compensation modeling overcome the issues to deliver high yields at ASE. Additionally, Adaptive Patterning’s ability to provide breakthrough ultra-high density device interface pitch of 20 μm area array for leading edge silicon nodes will be outlined. The ability of laser direct imaging (LDI) coupled with Adaptive Patterning to scale to ultra-high density 2 μm line & space redistribution layers (RDL) and below will be presented demonstrating industry benchmark performance without the need for complicated embedded bridge chip structures.
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