Factory Expansion Doubles Capacity and Reduces Cycle Time
Tempe, Ariz.—June 25, 2015—Deca Technologies, an electronic interconnect solutions provider to the semiconductor industry, announced today that it has shipped more than half a billion units since the company’s launch. Deca attributes this achievement to the very positive response from the industry to Deca’s value proposition of enabling reduced cycle times and lower overall costs for wafer-level chip scale packages (WLCSP), combined with the overall growth in the use of WLCSP. This increase in demand led Deca to expand its automated production line (Autoline) in its Laguna, Philippines factory, which doubles its capacity to accommodate growing market needs.
The handset, wearables and Internet-of-Things markets are driving demand for low-cost WLCSP devices with rapid turnaround from design to delivery. Meeting these demands has been problematic for the majority of the supply base. Time-to-ramp for new product introductions is critical, as is dynamic manufacturing capability from the WLCSP supply base. Deca’s Autoline has demonstrated that it significantly reduces cycle time, thereby giving customers an ability to respond to rapid market demand swings and the competitive edge to be first to market.
“We consistently set new industry records in supporting new product builds for our customers,” said Garry Pycroft, Vice President of Sales and Marketing at Deca Technologies. “Thanks to our Autoline, it’s now possible to get customers’ first parts out within 24 hours, while others are still awaiting delivery of mask sets to start the build. As such, Deca’s customers have a significant advantage in getting to market first.”
Deca’s Autoline further provides an advantage with the flexibility to support 200mm as well as 300mm wafers. “We’re seeing some reluctance from the supply base to invest in 200mm capacity, as the long-term ROI is being questioned,” said Chris Seams, CEO of Deca Technologies. “Our expansion provides additional capacity for 200mm and gives us the opportunity to capitalize on the growth in 300mm demand.”
“From Deca Technologies’ inception, our vision for the Autoline was to support the need for rapid cycle time and increased capacity,” Seams continued. “This vision has now been realized.”
About Deca Technologies
Founded in 2009 and launched in November 2011, Deca Technologies is an electronic interconnect solutions provider offering wafer-level packaging (WLP) services to the semiconductor industry. Headquartered in Tempe, Arizona, and with global capabilities, Deca is a majority-owned and fully independent subsidiary of Cypress Semiconductor Corp. (NASDAQ: CY). Deca’s mission is to deliver an exceptional customer experience through its proprietary and transformative interconnect technology. Integrating its solar and semiconductor background, Deca leverages unique equipment, processes and operational methods to break down traditional barriers in the continued adoption and growth of next-generation wafer-level electronic interconnect. For more information, please visit www.decatechnologies.com.
Deca Technology Company Contact:
VP Sales and Marketing Partner
Tel + 1 480 345 9895