November 7, 2012
Deca Technologies has introduced a new chip-scale packaging (CSP) product line offering a rugged, fully molded packaging technology in ball-grid array (BGA) style formats that eliminate the need for laminate substrates.
A year ago Deca launched its inaugural wafer-level chip-scale packaging (WLCSP) technology “derivatives,” developed with help from solar tech firm SunPower, promising a combination of speed, low cost, and flexibility. Much of the technology behind its work, though, was customized and deeply proprietary, with few details made available.
