July 4, 2019
The purpose of this article is to provide insight into why Deca’s Fan-Out Technology has recently been adopted by Qualcomm as a protection layer for its PMIC Fan-in Wafer-Level-Packaging (WLP) die.
The purpose of this article is to provide insight into why Deca’s Fan-Out Technology has recently been adopted by Qualcomm as a protection layer for its PMIC Fan-in Wafer-Level-Packaging (WLP) die.
