Minneapolis, MN – SMTA and Chip Scale Review magazine announced the best papers from the 2014 International Wafer-Level Packaging Conference (IWLPC.) Winners were selected from each of the three tracks covering Wafer Level Packaging, 3-D (Stacked) Packaging, and MEMS Packaging, as well as an overall Best Paper and Best of Conference winner. IWLPC brings together some of the semiconductor industry’s most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging.
Boyd Rogers, Deca Technologies, won the overall Best Paper as well the Best of the WLP Track designations for his paper titled “Enhancing WLCSP Reliability Through Build-Up Structure Improvements and New Solder Alloys.” Co-authors on the paper include M. Melgo, M. Almonte, S. Jayaraman, C. Scanlan, and T. Olson.
The Best of Conference Presentation went to Sumant Sood, KLA-Tencor, for his presentation titled “High Throughput Wafer Edge Inspection and Monitoring for Advanced Wafer Level Packaging.” Co-authors of the paper include Rohit Bhat, Heiko Eisenbach, Marc Filzen, Prashant Aji, Youxian Wen (KLA Tencor); Thomas Uhrmann, Julian Bravin, and Jürgen Burggraf (EV Group.)
The Best Paper from the 3D Track was awarded to Guilian Gao, Invensas Corporation, for her paper titled “Addressing Critical Assembly Challenges In 2.5D and 3D IC Assembly.” Co-authors on the paper include Scott McGrath, Bong-Sub Lee, Cyprian Uzoh, Grant Villavicencio, Hala Shaba, Liang Frank Wang, Sitaram Arkalgud, and Eric Tosaya.
The Best of the MEMS Track went to Cihan Yilmaz, Northeastern University, for his paper titled “A New Manufacturing Approach for Fabricating Next Generation 3-D Interconnects for MEMS and ICs Using Directed Nanoparticle Assembly.” The paper’s co-authors include Adnan Korkmaz, Steven Varni, and Ahmed Busnaina (Northeastern University); and Dongguang Wei (Carl Zeiss.)
Over fifty papers, including the Best Papers, are available in the IWLCP 2014 Proceedings on USB Flash Drive from the SMTA BookStore. http://www.smta.org/store/book_detail.cfm?book_id=446
This event continues to grow every year as wafer-level packaging gains traction in the semiconductor industry. The overall attendance of 720 technologists from 19 countries in 2014 indicated growth of nearly 26% compared to the 2013 event.
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.