A Sampling of Our Patents
The below list of patents apply to Deca’s products and technologies. Additional patents may be pending and the list will be updated from time to time as new patents issue. Patent numbers are included here to provide public notice of the patents.
| Patent Number | Patent Title | Country of Issue |
| 8799845 | ADAPTIVE PATTERNING FOR PANELIZED PACKAGING | U.S. |
| 9887103 | SEMICONDUCTOR DEVICE AND METHOD OF ADAPTIVE PATTERNING FOR PANELIZED PACKAGING | U.S. |
| 9978655 | SEMICONDUCTOR DEVICE AND METHOD OF ADAPTIVE PATTERNING FOR PANELIZED PACKAGING WITH DYNAMIC VIA CLIP | U.S. |
| 9818659 | MULTI-DIE PACKAGE COMPRISING UNIT SPECIFIC ALIGNMENT AND UNIT SPECIFIC ROUTING | U.S. |
| 11791207 | UNIT SPECIFIC VARIABLE OR ADAPTIVE METAL FILL AND SYSTEM AND METHOD FOR THE SAME | U.S. |
| 11887862 | SYSTEM AND METHOD FOR REDISTRIBUTION LAYER (RDL) REPAIR | U.S. |
| 8604600 | FULLY MOLDED FAN-OUT (DEVICE) | U.S. |
| 8535978 | DIE UP FULLY MOLDED FAN-OUT WAFER LEVEL PACKAGING | U.S. |
| 10720417 | THERMALLY ENHANCED FULLY MOLDED FAN-OUT MODULE | U.S. |
| 9761571 | THERMALLY ENHANCED FULLY MOLDED FAN-OUT MODULE | U.S. |
| 10373902 | FULLY MOLDED MINIATURIZED SEMICONDUCTOR MODULE | U.S. |
| 9502397 | 3D INTERCONNECT COMPONENT FOR FULLY MOLDED PACKAGES | U.S. |
| 10672624 | METHOD OF MAKING FULLY MOLDED PERIPHERAL PACKAGE ON PACKAGE DEVICE | U.S. |
| 10818635 | FULLY MOLDED SEMICONDUCTOR PACKAGE FOR POWER DEVICES AND METHOD OF MAKING THE SAME | U.S. |
| 11538759 | FULLY MOLDED BRIDGE INTERPOSER AND METHOD OF MAKING THE SAME | U.S. |
| 11728248 | FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH THROUGH SILICON VIA (TSV) VERTICAL INTERCONNECTS | U.S. |
| 11749534 | QUAD FLAT NO-LEAD (QFN) PACKAGE WITHOUT LEADFRAME AND DIRECT CONTACT INTERCONNECT BUILD-UP STRUCTURE AND METHOD FOR MAKING THE SAME | U.S. |
Adaptive Patterning® Patents
| ZL 201380033254.7 | INTEGRATED CIRCUIT PACKAGE AUTO-ROUTING | China |
| ZL 201380064057.1 | SEMICONDUCTOR DEVICE AND METHOD OF ADAPTIVE PATTERNING FOR PANELIZED PACKAGING | China |
| ZL 201180001658.9 | ADAPTIVE PATTERNING FOR PANELIZED PACKAGING | China |
| ZL 201580033193.3 | SEMICONDUCTOR DEVICE AND METHOD OF ADAPTIVE PATTERNING FOR PANELIZED PACKAGING WITH DYNAMIC VIA CLIP | China |
| ZL 201580045860.X | FRONT-SIDE PACKAGE LEVEL SERIALIZATION FOR PACKAGES COMPRISING UNIQUE IDENTIFIERS | China |
| ZL 201580062636.1 | AUTOMATED OPTICAL INSPECTION OF UNIT SPECIFIC PATTERNING | China |
| ZL 201680059697.7 | MULTI-DIE PACKAGE COMPRISING ADAPTIVE ALIGNMENT AND ROUTING | China |
| ZL 201780057483.0 | SEMICONDUCTOR DEVICE AND METHOD OF UNIT SPECIFIC PROGRESSIVE ALIGNMENT | China |
| 252341 | AUTOMATED OPTICAL INSPECTION OF UNIT SPECIFIC PATTERNING | Israel |
| 6685301 | AUTOMATED OPTICAL INSPECTION OF UNIT SPECIFIC PATTERNING | Japan |
| 6921257 | AUTOMATED OPTICAL INSPECTION OF UNIT SPECIFIC PATTERNING | Japan |
| 10-1957851 | SEMICONDUCTOR DEVICE AND METHOD OF ADAPTIVE PATTERNING FOR PANELIZED PACKAGING WITH DYNAMIC VIA CLIP | Korea |
| 10-2081684 | FRONT-SIDE PACKAGE LEVEL SERIALIZATION FOR PACKAGES COMPRISING UNIQUE IDENTIFIERS | Korea |
| 10-2595447 | AUTOMATED OPTICAL INSPECTION OF UNIT SPECIFIC PATTERNING | Korea |
| 10-2081682 | MULTI-DIE PACKAGE COMPRISING ADAPTIVE ALIGNMENT AND ROUTING | Korea |
| 10-2197228 | SEMICONDUCTOR DEVICE AND METHOD OF UNIT SPECIFIC PROGRESSIVE ALIGNMENT | Korea |
| 11201503242W | SEMICONDUCTOR DEVICE AND METHOD OF ADAPTIVE PATTERNING FOR PANELIZED PACKAGING | Singapore |
| 182715 | ADAPTIVE PATTERNING FOR PANELIZED PACKAGING | Singapore |
| 1674635 | MULTI-DIE PACKAGE COMPRISING ADAPTIVE ALIGNMENT AND ROUTING | Taiwan |
| I758327 | SEMICONDUCTOR DEVICE AND METHOD OF UNIT SPECIFIC PROGRESSIVE ALIGNMENT | Taiwan |
| 8799845 | ADAPTIVE PATTERNING FOR PANELIZED PACKAGING | U.S. |
| 9040316 | SEMICONDUCTOR DEVICE AND METHOD OF ADAPTIVE PATTERNING FOR PANELIZED PACKAGING WITH DYNAMIC VIA CLIP | U.S. |
| 9520331 | ADAPTIVE PATTERNING FOR PANELIZED PACKAGING | U.S. |
| 9418905 | ADAPTIVE PATTERNING FOR PANELIZED PACKAGING | U.S. |
| 8826221 | ADAPTIVE PATTERNING FOR PANELIZED PACKAGING | U.S. |
| 8656333 | INTEGRATED CIRCUIT PACKAGE AUTO-ROUTING | U.S. |
| 9196509 | SEMICONDUCTOR DEVICE AND METHOD OF ADAPTIVE PATTERNING FOR PANELIZED PACKAGING | U.S. |
| 9887103 | SEMICONDUCTOR DEVICE AND METHOD OF ADAPTIVE PATTERNING FOR PANELIZED PACKAGING | U.S. |
| 9397069 | SEMICONDUCTOR DEVICE AND METHOD OF ADAPTIVE PATTERNING FOR PANELIZED PACKAGING WITH DYNAMIC VIA CLIP | U.S. |
| 9978655 | SEMICONDUCTOR DEVICE AND METHOD OF ADAPTIVE PATTERNING FOR PANELIZED PACKAGING WITH DYNAMIC VIA CLIP | U.S. |
| 9520364 | FRONT SIDE PACKAGE-LEVEL SERIALIZATION FOR PACKAGES COMPRISING UNIQUE IDENTIFIERS | U.S. |
| 10056304 | AUTOMATED OPTICAL INSPECTION OF ADAPTIVE PATTERNING | U.S. |
| 9401313 | AUTOMATED OPTICAL INSPECTION OF UNIT SPECIFIC PATTERNING | U.S. |
| 9818659 | MULTI-DIE PACKAGE COMPRISING UNIT SPECIFIC ALIGNMENT AND UNIT SPECIFIC ROUTING | U.S. |
| 10573601 | SEMICONDUCTOR DEVICE AND METHOD OF UNIT SPECIFIC PROGRESSIVE ALIGNMENT | U.S. |
| 10157803 | SEMICONDUCTOR DEVICE AND METHOD OF UNIT SPECIFIC PROGRESSIVE ALIGNMENT | U.S. |
| 11791207 | UNIT SPECIFIC VARIABLE OR ADAPTIVE METAL FILL AND SYSTEM AND METHOD FOR THE SAME | U.S. |
| 11887862 | SYSTEM AND METHOD FOR REDISTRIBUTION LAYER (RDL) REPAIR | U.S. |
M-Series® Patents
| ZL 201180008457.X | FAN OUT WAFER LEVEL PACKAGE WITH TRANSFERRED DIELECTRIC | China |
| ZL 201280069322.0 | SEMICONDUCTOR DEVICE AND METHOD COMPRISING THICKENED REDISTRIBUTION LAYERS | China |
| ZL 201210311793.X | FULLY MOLDED FAN-OUT | China |
| ZL 201480008489.5 | SEMICONDUCTOR DEVICE AND METHOD OF LAND GRID ARRAY PACKAGING WITH BUSSING LINES | China |
| ZL 201680054403.1 | THERMALLY ENHANCED FULLY MOLDED FAN-OUT MODULE | China |
| ZL 2016800678271 | FULLY MOLDED MINIATURIZED SEMICONDUCTOR MODULE | China |
| 10-2434823 | SEMICONDUCTOR DEVICE AND METHOD COMPRISING THICKENED REDISTRIBUTION LAYERS | Korea |
| 10-2114563 | THERMALLY ENHAMCED FULLY MOLDED FAN-OUT MODULE | Korea |
| 10-2127774 | FULLY MOLDED MINIATURIZED SEMICONDUCTOR MODULE | Korea |
| 10201503498X | PANELIZED PACKAGING WITH TRANSFERRED DIELECTRIC | Singapore |
| 11201404309V | DIE UP FULLY MOLDED FAN-OUT WAFER LEVEL PACKAGING | Singapore |
| 11201404307T | FULLY MOLDED FAN-OUT | Singapore |
| 11201504442Y | SEMICONDUCTOR DEVICE AND METHOD OF LAND GRID ARRAY PACKAGING WITH BUSSING LINES | Singapore |
| I643271 | THERMALLY ENHANCED FULLY MOLDED FAN-OUT MODULE | Taiwan |
| I716732 | THERMALLY ENHANCED FULLY MOLDED FAN-OUT MODULE | Taiwan |
| 1674658 | FULLY MOLDED MINIATURIZED SEMICONDUCTOR MODULE | Taiwan |
| 8604600 | FULLY MOLDED FAN-OUT (DEVICE) | U.S. |
| 9269622 | SEMICONDUCTOR DEVICE AND METHOD OF LAND GRID ARRAY PACKAGING WITH BUSSING LINES | U.S. |
| 8535978 | DIE UP FULLY MOLDED FAN-OUT WAFER LEVEL PACKAGING | U.S. |
| 8922021 | DIE UP FULLY MOLDED FAN-OUT WAFER LEVEL PACKAGING | U.S. |
| 9337086 | DIE UP FULLY MOLDED FAN-OUT WAFER LEVEL PACKAGING | U.S. |
| 9177926 | SEMICONDUCTOR DEVICE AND METHOD COMPRISING THICKENED REDISTRIBUTION LAYERS | U.S. |
| 9576919 | SEMICONDUCTOR DEVICE AND METHOD COMPRISING REDISTRIBUTION LAYERS | U.S. |
| 9754835 | SEMICONDUCTOR DEVICE AND METHOD COMPRISING REDISTRIBUTION LAYERS | U.S. |
| 10373870 | SEMICONDUCTOR DEVICE AND METHOD OF PACKAGING | U.S. |
| 8835230 | FULLY MOLDED FAN-OUT (METHOD) | U.S. |
| 10720417 | THERMALLY ENHANCED FULLY MOLDED FAN-OUT MODULE | U.S. |
| 9761571 | THERMALLY ENHANCED FULLY MOLDED FAN-OUT MODULE | U.S. |
| 10373902 | FULLY MOLDED MINIATURIZED SEMICONDUCTOR MODULE | U.S. |
| 9831170 | FULLY MOLDED MINIATURIZED SEMICONDUCTOR MODULE | U.S. |
| ZL 201680003401.X | 3D INTERCONNECT COMPONENT FOR FULLY MOLDED PACKAGES | China |
| ZL 201680067520.1 | FULLY MOLDED PERIPHERAL PACKAGE ON PACKAGE DEVICE | China |
| ZL 201680067826.7 | FULLY MOLDED PERIPHERAL PACKAGE ON PACKAGE DEVICE | China |
| 10-2447319 | 3D INTERCONNECT COMPONENT FOR FULLY MOLDED PACKAGES | Korea |
| 10-2164011 | FULLY MOLDED PERIPHERAL PACKAGE ON PACKAGE DEVICE | Korea |
| 10-2164012 | FULLY MOLDED PERIPHERAL PACKAGE ON PACKAGE DEVICE | Korea |
| 10-2487891 | FULLY MOLDED SEMICONDUCTOR PACKAGE FOR POWER DEVICES AND METHOD OF MAKING THE SAME | Korea |
| I690044 | 3D INTERCONNECT COMPONENT FOR FULLY MOLDED PACKAGES | Taiwan |
| I771582 | FULLY MOLDED SEMICONDUCTOR PACKAGE FOR POWER DEVICES AND METHOD OF MAKING THE SAME | Taiwan |
| 9,502,397 | 3D INTERCONNECT COMPONENT FOR FULLY MOLDED PACKAGES | U.S. |
| 10,672,624 | METHOD OF MAKING FULLY MOLDED PERIPHERAL PACKAGE ON PACKAGE DEVICE | U.S. |
| 9,613,830 | FULLY MOLDED PERIPHERAL PACKAGE ON PACKAGE DEVICE | U.S. |
| 10,050,004 | FULLY MOLDED PERIPHERAL PACKAGE ON PACKAGE DEVICE | U.S. |
| 10,818,635 | FULLY MOLDED SEMICONDUCTOR PACKAGE FOR POWER DEVICES AND METHOD OF MAKING THE SAME | U.S. |
| 11056453 | STACKABLE FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH VERTICAL INTERCONNECTS | U.S. |
| 11538759 | FULLY MOLDED BRIDGE INTERPOSER AND METHOD OF MAKING THE SAME | U.S. |
| 11444051 | FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH FACE MOUNTED PASSIVES AND METHOD OF MAKING THE SAME | U.S. |
| 11664321 | MULTI-STEP HIGH ASPECT RATIO VERTICAL INTERCONNECT AND METHOD OF MAKING THE SAME | U.S. |
| 11616003 | STACKABLE FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH THROUGH SILICON VIA (TSV) VERTICAL INTERCONNECTS | U.S. |
| 11728248 | FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH THROUGH SILICON VIA (TSV) VERTICAL INTERCONNECTS | U.S. |
| 11749534 | QUAD FLAT NO-LEAD (QFN) PACKAGE WITHOUT LEADFRAME AND DIRECT CONTACT INTERCONNECT BUILD-UP STRUCTURE AND METHOD FOR MAKING THE SAME | U.S. |
Manufacturing Patents
| ZL 201480051294.9 | TWO STEP METHOD OF RAPID CURING A SEMICONDUCTOR POLYMER LAYER | China |
| ZL 201580069079.6 | METHOD OF MARKING A SEMICONDUCTOR PACKAGE | China |
| ZL 201680051785.2 | SEMICONDUCTOR DEVICE PROCESSING METHOD FOR MATERIAL REMOVAL | China |
| 6902017 | SEMICONDUCTOR DEVICE PROCESSING METHOD FOR MATERIAL REMOVAL | Japan |
| 7104826 | SEMICONDUCTOR DEVICE PROCESSING METHOD FOR MATERIAL REMOVAL | Japan |
| 10-2197220 | TWO STEP METHOD OF RAPID CURING A SEMICONDUCTOR POLYMER LAYER | Korea |
| 10-2506703 | METHOD OF MARKING A SEMICONDUCTOR PACKAGE | Korea |
| 10-2081683 | SEMICONDUCTOR DEVICE PROCESSING METHOD FOR MATERIAL REMOVAL | Korea |
| I664708 | METHOD OF MARKING A SEMICONDUCTOR PACKAGE | Taiwan |
| I692023 | SEMICONDUCTOR DEVICE PROCESSING METHOD FOR MATERIAL REMOVAL | Taiwan |
| 10204803 | TWO STEP METHOD OF RAPID CURING A SEMICONDUCTOR POLYMER LAYER | U.S. |
| 9159547 | TWO STEP METHOD OF RAPID CURING A SEMICONDUCTOR POLYMER LAYER | U.S. |
| 10373913 | METHOD OF MARKING A SEMICONDUCTOR PACKAGE | U.S. |
| 9613912 | METHOD OF MARKING A SEMICONDUCTOR PACKAGE | U.S. |
| 10600652 | SEMICONDUCTOR DEVICE PROCESSING METHOD FOR MATERIAL REMOVAL | U.S. |
| 9640495 | SEMICONDUCTOR DEVICE PROCESSING METHOD FOR MATERIAL REMOVAL | U.S. |
