November 29, 2012
With the recent announcement by STATSChipPAC (SCP) that they are offering eWLB as a platform for 2.5D-3D packaging solutions IFTLE thought that it was a good time for a review of the status and future of fan-out WLP (FO-WLP).
With the recent announcement by STATSChipPAC (SCP) that they are offering eWLB as a platform for 2.5D-3D packaging solutions IFTLE thought that it was a good time for a review of the status and future of fan-out WLP (FO-WLP).
