News and Media

SkyWater Signs Technology Transfer and License Agreement for Deca’s Gen 2 M-Series Fan-out and Adaptive Patterning Technology

Deca collaborates with ASE and Siemens to launch APDK™ design methodology

Deca in the News

EE Times: Deca Technologies, Part 2 – Adaptive Patterning

Deca in the News

EE Times: Deca Technologies, Part 1 – Spinning Square Platters

Deca in the News

2021 3D InCites Awards Nominees

YES Adds Deca’s Rapid Cure Technology to its Product Line

Deca Partners with ADTEC Engineering to Enhance Adaptive Patterning™ for 2µm Chiplet Scaling

Deca in the News

Semiconductor Engineering: Planning For Panel-Level Fan-Out

Deca in the News

3D InCites: The IWLPC Fan-out PLP Smack Down

Deca in the News

Semiconductor Engineering: M-Series Multi Site Capability

nepes corporation to acquire Deca Technologies manufacturing operations

Deca in the News

3D InCites: Deca FOWLP is Going Mainstream

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