Welcome to
Deca Technologies
M-Series™ Fan-Out Technology
The M-Series chips-first, face-up fan-out technology is an ideal platform for single & multi-die packaging, chiplet integration, 3D PoP and embedded die interposers scalable from 300mm wafers to 600mm panels.
Adaptive Patterning®
Deca’s Adaptive Patterning (AP) technology compensates for natural variation in embedded die structures without costly processes or design limitations. After high-speed optical measurement, Adaptive Patterning generates a bespoke and optimized layout for each device.
APDK™
Adaptive Patterning Design Kits (APDKs) provide a fully integrated solution for design of advanced devices. Design templates, tech files, stack-ups, DRC decks, and AP Studio software are bundled for convenience.
