M-Series™ Fan-Out Technology
The M-Series chips-first, face-up fan-out technology is an ideal platform for single & multi-die packaging, chiplet integration, 3D PoP and embedded die interposers scalable from 300mm wafers to 600mm panels.
Deca’s Adaptive Patterning (AP) technology compensates for natural variation in embedded die structures without costly processes or design limitations. After high-speed optical measurement, Adaptive Patterning generates a bespoke and optimized layout for each device.
Adaptive Patterning Design Kits (APDKs) provide a fully integrated solution for design of advanced devices. Design templates, tech files, stack-ups, DRC decks, and AP Studio software are bundled for convenience.